{"id":277,"date":"2025-12-10T03:46:07","date_gmt":"2025-12-10T03:46:07","guid":{"rendered":"https:\/\/www.fariplasmatech.com\/product\/fr-g800-dual-chamber-pecvd-system\/"},"modified":"2026-03-17T10:50:42","modified_gmt":"2026-03-17T02:50:42","slug":"fr-g800-dual-chamber-pecvd-system","status":"publish","type":"product","link":"https:\/\/www.fariplasmatech.com\/ja\/product\/fr-g800-dual-chamber-pecvd-system\/","title":{"rendered":"FR-G800 Dual-Chamber PECVD System"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"

The FR-G800 PECVD system is a dual-chamber plasma-enhanced CVD platform designed for low-temperature deposition of dielectric and optical thin films. It supports 2\u20138″ wafers and provides stable process control for both R&D and production environments.<\/p>\n","protected":false},"featured_media":369,"template":"","meta":{"inline_featured_image":false},"products":[30],"class_list":["post-277","product","type-product","status-publish","has-post-thumbnail","hentry","products-semiconductor-plasma-equipment"],"yoast_head":"\nFR-G800 Dual-Chamber PECVD System | Fari Plasma<\/title>\n<meta name=\"description\" content=\"Low-temperature dielectric and optical thin film deposition for 2\u20138" wafers. The FR-G800 dual-chamber PECVD system offers parallel processing, tight process control, and strong adhesion across R&D to production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.fariplasmatech.com\/ja\/product\/fr-g800-dual-chamber-pecvd-system\/\" \/>\n<meta property=\"og:locale\" content=\"ja_JP\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"FR-G800 Dual-Chamber PECVD System | Fari Plasma\" \/>\n<meta property=\"og:description\" content=\"Low-temperature dielectric and optical thin film deposition for 2\u20138" wafers. 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