{"id":288,"date":"2025-12-10T03:46:08","date_gmt":"2025-12-10T03:46:08","guid":{"rendered":"https:\/\/www.fariplasmatech.com\/product\/single-chamber-rie-reactive-ion-etcher\/"},"modified":"2026-03-17T11:44:07","modified_gmt":"2026-03-17T03:44:07","slug":"single-chamber-rie-reactive-ion-etcher","status":"publish","type":"product","link":"https:\/\/www.fariplasmatech.com\/ja\/product\/single-chamber-rie-reactive-ion-etcher\/","title":{"rendered":"Single-Chamber RIE Reactive Ion Etcher"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"

The FR-G200 single-chamber RIE system is engineered for anisotropic dry etching of silicon, SiN, and SiO2, providing stable process control and consistent pattern transfer for semiconductor, MEMS, and microfabrication applications.<\/p>\n","protected":false},"featured_media":333,"template":"","meta":{"inline_featured_image":false},"products":[30],"class_list":["post-288","product","type-product","status-publish","has-post-thumbnail","hentry","products-semiconductor-plasma-equipment"],"yoast_head":"\nSingle-Chamber RIE Etcher | Fari Plasma<\/title>\n<meta name=\"description\" content=\"The FR-G200 single-chamber RIE system offers anisotropic dry etching of Si, SiN, and SiO2 with tight endpoint control and repeatable recipes \u2014 ideal for MEMS, semiconductor R&D, and pilot production.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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