Semiconductor Plasma Equipment

Lead Frame Online Plasma Cleaner

Compact inline plasma system designed for lead-frame and LED-frame processing. Enables controlled surface preparation for metals, plastics, and glass using a stable, energy-efficient dry process.

  • Surface-only Modification.Preserves substrate properties.
  • Wide Material Compatibility.Metals, plastics, glass and polymers.
  • Dry & Eco-friendly.Low gas consumption, no chemicals or wastewater.

Tech Specs

Voltage AC 220V 50Hz
Plasma Power 600 W
Vacuum Chamber Volume 30 L
Gas Lines 2-channel mass flow controllers
Gas Pressure 0.6 MPa
Throughput 320 pcs/h (4 magazines)
Dimensions (L×W×H) 1900 × 1100 × 1800 mm
Utilization Rate 95%
Operating Temperature Range -10 °C to 50 °C

Key Features

  • Surface Only Modification Technology

    Plasma treatment acts only on the outermost surface layer, enhancing surface readiness for downstream processes while preserving the mechanical, electrical, and chemical integrity of the substrate.

  • Wide Material Compatibility Range

    Suitable for metals, plastics (PP, PE, PET, PC, PVC, PTFE), glass and various polymers, supporting surface preparation prior to coating, printing, bonding, and plating across a wide range of materials.

  • High Throughput Vacuum Processing

    Equipped with a 30 L vacuum chamber and automated handling delivering up to 320 pieces per hour (4 magazines), designed for continuous inline operation and stable production yields.

  • Energy Saving and Eco Friendly Operation

    Dry, low-gas plasma process eliminates chemical agents and wastewater, reducing operating costs and environmental impact while maintaining consistent and repeatable process conditions.

  • Precise Gas and Power Control

    600 W plasma source combined with 2-channel mass flow control delivers repeatable process parameters and tight control over gas composition and discharge power for consistent surface treatment.

  • User Friendly Operation and Integration

    Simple, controllable process with high availability (95% utilization), straightforward integration into production lines, and operating range suitable for typical factory environments (-10 °C to 50 °C).

Plasma Cleaning Process

  • Plasma Generation

    Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.

  • Plasma–Surface Interaction

    Energetic plasma species interact with surface molecules and contaminants under controlled vacuum conditions.

  • Chemical Reaction

    Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.

  • Volatilization

    The reaction products are converted into volatile compounds and enter the gas phase.

  • Removal from Surface

    Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.