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The FR-G800 ICP dual-chamber etcher produces high-density inductively coupled plasma for precise etching of silicon, oxides, III-V compounds and metals. It features load-lock isolation for safe wafer transfer and flexible gas and RF control for R&D and production.<\/p>\n","protected":false},"featured_media":379,"template":"","meta":{"inline_featured_image":false},"products":[30],"class_list":["post-273","product","type-product","status-publish","has-post-thumbnail","hentry","products-semiconductor-plasma-equipment"],"yoast_head":"\nFR-G800 ICP Dual-Chamber Etcher - Fari Plasma<\/title>\n<meta name=\"robots\" content=\"noindex, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta property=\"og:locale\" content=\"ko_KR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"FR-G800 ICP Dual-Chamber Etcher - Fari Plasma\" \/>\n<meta property=\"og:description\" content=\"The FR-G800 ICP dual-chamber etcher produces high-density inductively coupled plasma for precise etching of silicon, oxides, III-V compounds and metals. 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