{"id":273,"date":"2025-12-10T03:46:06","date_gmt":"2025-12-10T03:46:06","guid":{"rendered":"https:\/\/www.fariplasmatech.com\/product\/fr-g800-icp-dual-chamber-etcher\/"},"modified":"2026-03-16T19:27:21","modified_gmt":"2026-03-16T11:27:21","slug":"fr-g800-icp-dual-chamber-etcher","status":"publish","type":"product","link":"https:\/\/www.fariplasmatech.com\/ko\/product\/fr-g800-icp-dual-chamber-etcher\/","title":{"rendered":"FR-G800 ICP Dual-Chamber Etcher"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"

The FR-G800 ICP dual-chamber etching system generates high-density inductively coupled plasma for precise etching of silicon, oxides, III-V materials and metals. A load-lock isolation structure enables safe wafer transfer, while flexible gas and RF control support both research and production processes.<\/p>\n","protected":false},"featured_media":379,"template":"","meta":{"inline_featured_image":false},"products":[30],"class_list":["post-273","product","type-product","status-publish","has-post-thumbnail","hentry","products-semiconductor-plasma-equipment"],"yoast_head":"\nFR-G800 ICP Dual-Chamber Etcher | Fari Plasma<\/title>\n<meta name=\"description\" content=\"Precision ICP etching for silicon, oxides, metals and III-V materials. The FR-G800 dual-chamber etcher combines load-lock isolation with independent RF bias for research and production flexibility.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.fariplasmatech.com\/ko\/product\/fr-g800-icp-dual-chamber-etcher\/\" \/>\n<meta property=\"og:locale\" content=\"ko_KR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"FR-G800 ICP Dual-Chamber Etcher | Fari Plasma\" \/>\n<meta property=\"og:description\" content=\"Precision ICP etching for silicon, oxides, metals and III-V materials. 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