Fari Plasma systems deliver controlled surface activation and contaminant removal for thermoplastics and elastomers, improving wettability and adhesion. Vacuum plasma cleaners handle delicate assemblies while atmospheric plasma treatment systems enable inline web and extrusion processing.

Process parameters such as power density, gas chemistry (oxygen, argon, nitrogen) and exposure time are precisely controlled to tailor surface energy without damaging substrates. For micro-scale features and descum on patterned polymers, our semiconductor plasma equipment provides repeatable, low-damage etch and cleaning capability.

Fari Plasma delivers controlled plasma surface treatment for plastics and elastomers, improving adhesion and process stability across inline and batch production.
Plasma treatment increases surface energy on low-wettability plastics and elastomers, enabling reliable printing, coating, bonding, and overmolding.
Low-temperature plasma treats heat-sensitive plastics without distortion or stress, preserving mechanical properties and dimensional stability.
Controlled plasma etching removes thin contamination layers and performs micro-etching to improve coating and adhesive bonding performance.
Atmospheric plasma systems integrate into roll-to-roll and extrusion lines, delivering repeatable surface treatment for high-throughput production.
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