Automotive & Industrial
Improve bonding, sealing, coating, and painting performance on metals, composites, and engineered plastics—ideal for sensors, components, and assemblies.
Plasma cleaning removes micro-contaminants and activates delicate surfaces for reliable wire bonding, encapsulation, chip packaging, and PCB manufacturing.
Fari Plasma's semiconductor plasma equipment provides controlled wafer-scale cleaning, ashing and descum to ensure particle-free surfaces and reliable film adhesion. Plasma cleaners and plasma treatment systems remove organic residues and tailor surface energy without wet chemistry, reducing contamination risk and improving process repeatability.
Our plasma treatment systems integrate with front-end and back-end process lines to support adhesion promotion, oxide removal and dielectric conditioning with recipe-level control. Low-damage RF and remote plasma options enable nanometer-scale cleaning and functionalization while preserving delicate device features.
Recipe-driven RF and remote plasma control for reproducible surface treatments.
Low-energy plasma modes clean without etching sensitive microstructures.
Rack and inline configurations for wafer-line and roll-to-roll integration.
High-vacuum chambers with contaminant-free materials for clean processing.
Fari Plasma provides semiconductor-grade plasma cleaning and surface control, delivering low-damage, repeatable processes for electronics manufacturing.
Low-energy plasma modes remove organic residues and micro-contaminants while preserving delicate device features and critical dimensions.
High-vacuum chambers built with contaminant-free materials ensure particle-free processing and stable conditions for semiconductor applications.
Rack, inline, and batch plasma systems integrate with front-end and back-end lines for reliable wafer and electronics production workflows.
Recipe-driven RF and remote plasma control deliver reproducible surface treatments with precise control over power, gas chemistry, and exposure time.
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