Technical & Specifications
Our systems treat plastics, rubber, metals, ceramics, glass, composites, semiconductors, and various advanced materials.
Plasma itself is non-thermal. Surface temperature rise is typically limited and quickly dissipates, making it suitable for sensitive substrates.
Yes. Plasma treatment is a low-temperature process, and surface heating is minimal and short-duration.
Common gases include oxygen, argon, nitrogen, hydrogen, air, and mixed process gases, depending on the application and material.
Yes. Our semiconductor plasma equipment supports photoresist stripping, ashing, descum, surface activation, and micro-etching with stable and repeatable results.