FAQs

Technical & Specifications

Technical details covering plasma types, process gases, material compatibility, and key performance characteristics of our systems.

FAQS

Technical & Specifications

What materials can be treated with your plasma equipment?

Our systems treat plastics, rubber, metals, ceramics, glass, composites, semiconductors, and various advanced materials.

What is the plasma temperature at the nozzle or chamber?

Plasma itself is non-thermal. Surface temperature rise is typically limited and quickly dissipates, making it suitable for sensitive substrates.

Is plasma treatment safe for heat-sensitive materials?

Yes. Plasma treatment is a low-temperature process, and surface heating is minimal and short-duration.

Which gases can be used in your plasma systems?

Common gases include oxygen, argon, nitrogen, hydrogen, air, and mixed process gases, depending on the application and material.

Do your systems support precise semiconductor processes?

Yes. Our semiconductor plasma equipment supports photoresist stripping, ashing, descum, surface activation, and micro-etching with stable and repeatable results.

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