GD-60 Vacuum Plasma Cleaner

GD-60 vacuum plasma cleaner delivers stable high-density plasma for cleaning, activation, etching and coating. PLC + touch-screen control ensures easy operation while improving surface adhesion and removing organic contaminants.

Stable high-density plasma for reliable processing
PLC + touch-screen control, simple operation
Adjustable power and multi-gas compatibility

Get A Quote Tech Specs

Tech Specs

Product Name	Vacuum Plasma Cleaner
Model	GD-60
Control System	PLC + Touch Screen
Power Frequency	13.56 MHz / 40 kHz
Supply Power	AC 380V (±10V)
Power Rating	600 W (adjustable)
Gas Channels	2-channel proportional valve flow control
Process Control	Automatic and Manual modes
Chamber Internal Size	380 × 380 × 450 mm
Chamber Material	Stainless steel; Aluminum alloy (optional)
Carrier Specification	W375 × D375 mm, standard 6 layers
External Dimensions	870 × 740 × 1540 mm (L × D × H)
Chamber Volume	60 L
Vacuum Range	10–30 Pa
Compatible Gases	Ar, O2, N2, Air, H2+N2 (mixed gases), etc.

Key Features

High-Stability Plasma Generator

Advanced plasma generator provides stable, high-density plasma output to ensure consistent cleaning, surface activation and repeatable process results across batches and production cycles.
User-Friendly Control Interface

Integrated PLC with a responsive touch-screen enables intuitive recipe management, easy parameter adjustments and straightforward switching between automatic and manual process modes.
Adjustable RF and AC Frequencies

Dual-frequency capability (13.56 MHz and 40 kHz) allows flexible process optimization for different materials and treatments, improving etch, activation and contamination removal performance.
Versatile Gas Compatibility

Supports a wide range of process gases including argon, oxygen, nitrogen, air and hydrogen/nitrogen blends to tailor surface chemistry for adhesion, cleaning or functionalization requirements.
Precise Vacuum & Flow Control

Accurate vacuum control to 10–30 Pa combined with 2-channel proportional valve gas flow enables reproducible process atmosphere management and fine tuning of surface reactions.
Compact 60L Chamber Design

60-liter chamber with 380×380×450 mm internal space and standard multi-layer carriers provides a compact footprint while accommodating diverse parts and batch processing needs.

Plasma Cleaning Process

Plasma Generation

Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.
Plasma–Surface Interaction

High-energy plasma species reach the material surface and interact with contaminants at the molecular level.
Chemical Reaction

Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.
Volatilization

The reaction products are converted into volatile compounds and enter the gas phase.
Removal from Surface

Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.