Plasma Treatment Systems

GM-2000 Plasma Treatment System

The GM-2000 is a low-temperature atmospheric plasma treatment system for surface cleaning and activation of plastics, metals, glass and electronic components, improving adhesion before coating, printing or bonding.

  • Wide material compatibility and functionality.
  • Adjustable power up to 1000W and 18–25 kHz frequency.
  • Interchangeable nozzle widths for targeted treatment.

Tech Specs

Product Name Low-temperature plasma surface cleaner
Model GM-2000
Power Supply AC 220V, 50/60 Hz
Power 1000 W (adjustable)
Frequency 18–25 kHz
Main Unit Size 380 × 280 × 280 mm
Gun Model DV1
Nozzle Count 1
Nozzle Treatment Width 3–5 mm, 7–13 mm, 15–18 mm (optional)
Online Connectivity Can be integrated with onsite equipment
Treatment Height (Working Distance) 5–15 mm (recommended 10 ±2 mm)
Cable Length 2 m (extendable)
Compatible Gases N2, CDA
Nozzle Weight 1.5 kg
Air Pressure 2–2.5 kgf/cm²
Total Weight 20 kg

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Key Features

  • Wide Material Compatibility and Functionality

    Treats a broad range of substrates including plastics (PP, PC, PE, ABS, PA), metals, glass, ITO and coated films to remove contaminants and increase surface energy for improved adhesion and wetting.

  • Adjustable Power and Frequency Control

    Provides up to 1000W of adjustable power and stable 18–25 kHz operation so plasma intensity can be precisely tuned for delicate components or heavy-duty surface activation without causing damage.

  • Precision Nozzle Options for Flexibility

    Offers selectable nozzle treatment widths (3–5 mm, 7–13 mm, 15–18 mm) and a lightweight DV1 gun to target small features or wider areas with consistent, repeatable results across varied production needs.

  • High-frequency Plasma Generation for Efficiency

    AC-driven high-frequency plasma produces consistent ionization and uniform surface activation, enhancing coating adhesion, solderability and bonding reliability for electronics, automotive and optical parts.

  • On-line Integration with Production Lines

    Designed for seamless integration with conveyors, pick-and-place and coating equipment; supports synchronized operation for inline cleaning, activation and pre-treatment in automated manufacturing environments.

  • Compact Portable Design for Easy Deployment

    Compact 380×280×280 mm controller, 2 m extendable cable and a lightweight nozzle (1.5 kg) make the system easy to deploy at workstations or production cells for flexible on-site use and maintenance.

Plasma Cleaning Process

  • Plasma Generation

    Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.

  • Plasma–Surface Interaction

    High-energy plasma species reach the material surface and interact with contaminants at the molecular level.

  • Chemical Reaction

    Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.

  • Volatilization

    The reaction products are converted into volatile compounds and enter the gas phase.

  • Removal from Surface

    Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.