Semiconductors & Electronics

Plasma Surface Solutions for Semiconductors & Electronics

Plasma processing prepares semiconductor and electronic components for precision assembly processes such as wire bonding, encapsulation, chip packaging, and PCB manufacturing.

What we do

Plasma Solutions for Semiconductor and Electronics Manufacturing

Fari Plasma's semiconductor plasma equipment supports wafer-scale cleaning, ashing, and descum processes to maintain stable surface conditions for advanced semiconductor manufacturing. Plasma cleaners and plasma treatment systems remove organic residues and stabilize surface conditions without wet chemistry, reducing contamination risk and improving process consistency.

Our plasma treatment systems integrate with front-end and back-end process lines to support oxide removal and dielectric conditioning with recipe-level control. Low-damage RF and remote plasma options enable nanometer-scale cleaning and functionalization while preserving delicate device features.

Key Features For Plasma Treatment

  • Precise Process Control

    Recipe-driven RF and remote plasma control for reproducible surface treatments.

  • Low-Damage Cleaning

    Low-energy plasma modes remove residues while preserving sensitive microstructures and device features.

  • Inline Production Integration

    Rack and inline configurations for wafer-line and roll-to-roll integration.

  • Semiconductor-grade Vacuum

    High-vacuum chambers with contaminant-free materials for clean processing.

Applications

Specific Applications

  • Ashing and Descum
  • Wafer Surface Activation
  • Bump and Bond Cleaning
Advantages

Why Choose Us

Fari Plasma provides semiconductor-grade plasma cleaning and surface control, delivering low-damage, repeatable processes for electronics manufacturing.

  • Low-Damage Plasma Cleaning

    Low-energy plasma modes remove process residues while maintaining device features and critical semiconductor dimensions.

  • Semiconductor-Grade Vacuum

    High-vacuum chambers built with contaminant-free materials ensure particle-free processing and stable conditions for semiconductor applications.

  • Inline & Batch Integration

    Rack, inline, and batch plasma systems integrate with front-end and back-end lines for reliable wafer and electronics production workflows.

  • Recipe-Level Process Control

    Recipe-driven RF and remote plasma control deliver reproducible surface treatments with precise control over power, gas chemistry, and exposure time.

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