Fari Plasma systems provide controlled plasma surface preparation and contamination removal for thermoplastics and elastomers used in modern manufacturing processes. Vacuum plasma cleaners handle delicate assemblies while atmospheric plasma treatment systems enable inline web and extrusion processing.

Process parameters such as power density, gas chemistry (oxygen, argon, nitrogen) and exposure time are precisely controlled to tailor surface energy without damaging substrates. For micro-scale features and descum on patterned polymers, our semiconductor plasma equipment provides repeatable, low-damage etch and cleaning capability.

Fari Plasma systems provide stable plasma surface preparation for plastics and elastomers used in both inline and batch manufacturing environments.
Plasma processing prepares low-surface-energy polymers for downstream processes such as printing, coating, bonding, and overmolding in industrial production.
Low-temperature plasma treats heat-sensitive plastics without distortion or stress, preserving mechanical properties and dimensional stability.
Controlled plasma etching removes thin contamination layers and performs micro-etching to improve coating and adhesive bonding performance.
Atmospheric plasma systems integrate into roll-to-roll and extrusion lines, delivering repeatable surface treatment for high-throughput production.
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