Compact RF Oxygen Plasma Surface Cleaning

Compact RF vacuum plasma cleaning system featuring PLC touch-screen control, a 13.56 MHz RF source with up to 300 W adjustable power, a 10 L 316 stainless chamber, dual gas lines, and a 10–30 Pa operating vacuum.

Precision cleaning with uniform plasma
PLC + touch screen — easy operation
Customizable chamber and gas configuration

Get A Quote Tech Specs

Tech Specs

Product	Vacuum plasma cleaner
Model	GD-10RF
Control System	PLC + touch screen
Power Frequency	13.56 MHz
Power Supply	AC220V (±10V)
Power Output	300 W (adjustable)
Gas Lines	2-channel float flow control
Process Control	Automatic and manual modes
Chamber Size (mm)	200 × 250 × 200 (W × D × H), 316 stainless steel
Carrying Tray	175 × 185 (W × D), 3 layers
Overall Dimensions (mm)	600 × 560 × 600 (L × D × H)
Chamber Volume	10 L
Vacuum Range	10–30 Pa
Admissible Gases	Argon, Oxygen, Nitrogen, Air, H2+N2 (mixed gases)

Key Features

Intuitive PLC and Touch Control

Integrated PLC with a responsive touch-screen interface simplifies recipe setup, process monitoring and maintenance tasks, reducing operator training time and improving repeatability in small-batch production.
Stable RF Power Delivery

13.56 MHz RF source delivers up to 300 W adjustable power to ensure stable plasma generation and repeatable treatment conditions across a wide range of materials and process requirements.
Corrosion-Resistant Stainless Chamber

316 stainless steel chamber construction provides excellent chemical resistance and long service life, while allowing custom chamber dimensions to accommodate specific product geometries and fixtures.
Dual Gas Flow Control

Two independent gas channels with precision float meters enable flexible gas mixtures and process recipes, supporting argon, oxygen, nitrogen, air and H2/N2 blends for plasma processing applications.
Compact Footprint for Labs

Small external dimensions and a 10L internal volume make the unit ideal for R&D labs and small-scale production, offering three-layer carriers and easy integration into benchtop workflows.
Wide Process Flexibility

Automatic and manual process modes, adjustable power and controllable vacuum (10–30 Pa) deliver adaptable processing for cleaning, activation, sterilization and surface modification across industries.

Plasma Cleaning Process

Plasma Generation

Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.
Plasma–Surface Interaction

Energetic plasma species interact with surface molecules and contaminants under controlled vacuum conditions.
Chemical Reaction

Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.
Volatilization

The reaction products are converted into volatile compounds and enter the gas phase.
Removal from Surface

Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.