Low-Temperature Plasma Surface Activation

The GM-2000 is a low-temperature atmospheric plasma treatment system designed for material processing of plastics, metals, glass, and electronic components prior to coating, printing, or assembly processes.

Wide material compatibility and functionality.
Adjustable power up to 1000W and 18–25 kHz frequency.
Interchangeable nozzle widths for targeted treatment.

Get A Quote Tech Specs

Tech Specs

Product Name	Low-temperature plasma processing system
Model	GM-2000
Power Supply	AC 220V, 50/60 Hz
Power	1000 W (adjustable)
Frequency	18–25 kHz
Main Unit Size	380 × 280 × 280 mm
Gun Model	DV1
Nozzle Count	1
Nozzle Treatment Width	3–5 mm, 7–13 mm, 15–18 mm (optional)
Online Connectivity	Can be integrated with onsite equipment
Treatment Height (Working Distance)	5–15 mm (recommended 10 ±2 mm)
Cable Length	2 m (extendable)
Compatible Gases	N2, CDA
Nozzle Weight	1.5 kg
Air Pressure	2–2.5 kgf/cm²
Total Weight	20 kg

Key Features

Wide Material Compatibility and Functionality

Treats a broad range of substrates including plastics (PP, PC, PE, ABS, PA), metals, glass, ITO, and coated films to remove contaminants and improve process consistency for coating, printing, and assembly operations.
Adjustable Power and Frequency Control

Provides up to 1000W of adjustable power and stable 18–25 kHz operation so plasma intensity can be precisely tuned for delicate components or heavy-duty surface activation without causing damage.
Precision Nozzle Options for Flexibility

Offers selectable nozzle treatment widths (3–5 mm, 7–13 mm, 15–18 mm) and a lightweight DV1 gun to target small features or wider areas with consistent, repeatable results across varied production needs.
High-frequency Plasma Generation for Efficiency

AC-driven high-frequency plasma produces consistent ionization and uniform surface activation, improving coating and assembly reliability, solderability and bonding reliability for electronics, automotive and optical parts.
On-line Integration with Production Lines

Designed for seamless integration with conveyors, pick-and-place and coating equipment; supports synchronized operation for inline cleaning, activation and pre-treatment in automated manufacturing environments.
Compact Portable Design for Easy Deployment

Compact 380×280×280 mm controller, 2 m extendable cable and a lightweight nozzle (1.5 kg) make the system easy to deploy at workstations or production cells for flexible on-site use and maintenance.

Plasma Cleaning Process

Plasma Generation

Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.
Plasma–Surface Interaction

Energetic plasma species interact with surface molecules and contaminants under controlled vacuum conditions.
Chemical Reaction

Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.
Volatilization

The reaction products are converted into volatile compounds and enter the gas phase.
Removal from Surface

Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.