Plasma Cleaners

GD-10 Compact Vacuum Plasma Cleaner

The GD-10 is a compact laboratory vacuum plasma cleaner with PLC + touch screen control, dual gas channels and a uniform electrode design. Ideal for small-scale production and scientific experiments requiring reliable surface activation and cleaning.

  • Precision cleaning with uniform plasma distribution
  • PLC + touch screen — simple operation and maintenance
  • Customizable chamber and dual gas flow control

Tech Specs

Product Name Vacuum Plasma Cleaner
Model GD-10
Control System PLC + Touch Screen
Power Frequency 40 kHz
Supply Voltage AC 220V (±10V)
Power 300 W (adjustable)
Gas Channels 2 channels with float flow meters
Process Control Automatic and Manual modes
Chamber Inner Dimensions (mm) 200 × 250 × 200 (W × D × H), stainless steel
Carrier Capacity 175 × 185 (W × D), 3 levels
External Dimensions (mm) 600 × 560 × 400 (L × D × H)
Chamber Volume 10 L
Vacuum Level 10–30 Pa
Compatible Gases Argon, Oxygen, Nitrogen, Air, H2+N2 (mixed), etc.

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Key Features

  • User-Friendly PLC Touch Control

    Integrated PLC with a responsive touch screen simplifies operation, recipe management and maintenance, enabling repeatable processes and quick adjustment for lab or small production runs.

  • Dual Gas Flow Precision Control

    Two independent float flow-controlled gas channels allow precise mixture control for different process chemistries, improving repeatability and enabling a wide range of surface treatments.

  • Uniform Plasma Electrode Design

    A specially designed electrode structure delivers uniform plasma across the chamber, ensuring consistent surface activation and cleaning for multiple parts and layered loading configurations.

  • Compact Laboratory Footprint

    Small external dimensions and a 10 L chamber make the unit ideal for laboratory benches and small-scale production lines while still accommodating multi-layer carriers for throughput.

  • Adjustable Power and Process Modes

    Adjustable 300 W power output and both automatic and manual process control modes provide flexibility to optimize treatment intensity and cycle times for sensitive materials.

  • Wide Gas Compatibility

    Supports common process gases including argon, oxygen, nitrogen, air and H2/N2 mixes, enabling applications from cleaning and activation to gentle surface modification for diverse materials.

Plasma Cleaning Process

  • Plasma Generation

    Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.

  • Plasma–Surface Interaction

    High-energy plasma species reach the material surface and interact with contaminants at the molecular level.

  • Chemical Reaction

    Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.

  • Volatilization

    The reaction products are converted into volatile compounds and enter the gas phase.

  • Removal from Surface

    Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.