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The FR-G200 single-chamber RIE system is engineered for anisotropic dry etching of silicon, SiN, and SiO2, providing stable process control and consistent pattern transfer for semiconductor, MEMS, and microfabrication applications.10 Dec, 2025Single-Chamber RIE Reactive Ion Etcher -
RD-200 is a large-capacity vacuum drum plasma system designed for batch surface processing of complex and bulk components. Equipped with a 200L rotating chamber, controlled plasma power, and precision gas flow management, it enables stable and repeatable treatment for industrial-scale production.10 Dec, 2025RD-200 Large Vacuum Drum Cleaner -
A compact rotary vacuum plasma system featuring a 360° rotating chamber for uniform processing of powders, particles, and irregular components in controlled vacuum environments.10 Dec, 2025Rotary Drum Vacuum Plasma Surface Treatment -
The PM-V8 is a low-temperature inline plasma treatment system designed for automated production lines. It supports interchangeable nozzles, operates with compressed air or nitrogen, and utilizes stable cold-arc discharge for consistent surface preparation in industrial processes.10 Dec, 2025Low-Temperature Inline Plasma Surface Treatment -
The PM-V84 is designed for inline production environments, enabling automated plasma processing with flexible nozzle configurations. It operates using compressed air or nitrogen and utilizes low-temperature plasma discharge for stable, continuous treatment in industrial workflows.10 Dec, 2025Quad-Nozzle Inline Plasma Surface Activation -
An automatable low-temperature plasma system designed for inline surface treatment and seamless integration into continuous production environments. It supports multiple nozzle configurations and operates with compressed air or nitrogen, featuring beltless silent nozzles and cold-arc discharge for safe, eco-friendly performance.10 Dec, 2025Triple-Nozzle Inline Plasma Surface Activation
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