RD-200 Large Vacuum Drum Cleaner

RD-200 is a large-capacity vacuum drum plasma cleaner with a 200L chamber (Φ610×700 mm). It features 40kHz plasma, adjustable 1–5 kW power, PLC + touchscreen control, dual gas MFC and 1–10 rpm drum rotation with 10 Pa vacuum.

Large-capacity 200L Vacuum Drum.
40kHz Plasma,1–5kW Adjustable Power.
PLC + Touchscreen,Easy Operation.

Get A Quote Tech Specs

Tech Specs

Product Name	Drum Vacuum Plasma Cleaner
Model	RD-200
Control System	PLC + Touch Screen
Plasma Frequency	40 kHz
Power Supply	AC380V (±10V)
Plasma Power (adjustable)	1–5 kW
Gas Channels	2 channels with mass flow controller (MFC)
Process Control Modes	Automatic and Manual
Chamber Size (mm)	Φ610 × 700 mm
Cabinet Dimensions (L×W×H mm)	870 × 740 × 1540 mm
Chamber Volume	200 L
Drum Rotation Speed	1–10 turns/min
Vacuum Level	10 Pa

Key Features

High Capacity Vacuum Chamber

A spacious 200L vacuum chamber (Φ610×700 mm) accommodates large or multiple parts for batch processing, improving throughput while maintaining uniform plasma treatment across surfaces.
Adjustable Plasma Power Range

The plasma generator delivers a 40 kHz output with 1–5 kW adjustable power, allowing process tuning from light surface activation to deeper cleaning for diverse materials and process requirements.
Precision Gas Flow Control

Dual gas channels with mass flow controllers (MFC) provide accurate and repeatable gas mixture control, ensuring consistent plasma chemistry for stable surface activation and contamination removal.
User-friendly PLC Touch Interface

Integrated PLC plus touchscreen simplifies recipe setup, monitoring and diagnostics, enabling operators to run repeatable automatic or manual processes with minimal training and fast changeovers.
Rotating Drum for Uniform Treatment

Controlled drum rotation (1–10 rpm) inside the vacuum chamber ensures even exposure of complex or cylindrical parts to plasma, increasing treatment uniformity and process yields.
Industrial-grade Vacuum Performance

Designed to reach and maintain ~10 Pa vacuum, the system supports effective low-pressure plasma processes for improved surface activation, adhesion promotion and reliable contaminant removal.

Plasma Cleaning Process

Plasma Generation

Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.
Plasma–Surface Interaction

High-energy plasma species reach the material surface and interact with contaminants at the molecular level.
Chemical Reaction

Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.
Volatilization

The reaction products are converted into volatile compounds and enter the gas phase.
Removal from Surface

Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.