Automatic Dispensing Platform

This automatic dispensing platform is built for programmable adhesive dispensing on precision parts. It supports dots, lines, arcs, circles, and free-path trajectories, and it also enables 3D dispensing on uneven surfaces. With stable motion control and flexible programming, the platform helps improve bead consistency, positioning repeatability, and production efficiency for bonding, sealing, potting, and coating tasks.

Supports dot, line, arc, circle, and free-path dispensing with continuous path input
Enables 3D dispensing to handle uneven surfaces and height variations
Runs fast, stable motion with repeatable positioning for consistent bead quality
Works with a wide range of adhesives, pastes, inks, and coating materials

Get A Quote Tech Specs

Tech Specs

Model	D331 (customizable)
Travel Range	X: 300 mm; Y: 300 mm; Z: 100 mm
Machine Dimensions (L × W × H)	610 × 610 × 660 mm
Machine Weight	42 kg
Power Supply	AC 220 V, 50–60 Hz, 350 W
Max Speed	500 mm/s (customizable to 800 mm/s or higher)
Repeatability	±0.02 to 0.05 mm
Dispensing Valve	Syringe dispensing valve
Control System	Self-developed control system
Programming	Teach pendant programming; graphic import
Drive Method	Motor + timing belt + linear guide rail
Working Air Pressure	600–1200 hPa
File Storage	Handheld box 256 MB; offline card 32 MB (up to 100,000 processing points)
Compatible Materials	Solder paste, hot melt glue, silicone, epoxy, UV adhesive, anaerobic adhesive, ink, threadlocker, adhesives, SMT red glue, instant adhesive, conductive silver paste, grease, sealant, coating glue, chemical reagents, underfill, white glue, and more

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Key Features

Programmable Path Dispensing

Supports dots, lines, arcs, circles, and free-path trajectories with continuous curve input for stable, repeatable output.
Any-Point Dispensing on Complex Paths

Dispenses precisely at any point along lines, arcs, circles, and irregular curves to match different product geometries.
High-Speed, Low-Noise Motion

Runs smooth motion at high speed with stable output, helping maintain bead consistency across long production runs.
Static Elimination Support

Helps reduce electrostatic effects during operation to improve process stability on sensitive parts.
Automatic Dispense-Height Compensation

Automatically compensates dispense height changes to simplify setup and improve consistency when parts vary in height.
Flexible XY Positioning and Fixture Adaptation

Supports XY array operation, plane rotation motion, and reverse rotation table options to match different fixtures and positioning needs.

Application

Plasma Cleaning Process

Plasma Generation

Process gas is energized and converted into a reactive plasma containing ions, electrons, and radicals.
Plasma–Surface Interaction

High-energy plasma species reach the material surface and interact with contaminants at the molecular level.
Chemical Reaction

Reactive ions and radicals break down organic residues and surface contaminants through controlled chemical reactions.
Volatilization

The reaction products are converted into volatile compounds and enter the gas phase.
Removal from Surface

Gaseous by-products desorb from the surface and are evacuated, leaving a clean, activated material surface.