Are spare parts available, and which materials/wafer sizes does the equipment support?

Spare-parts support runs through the after-sales stage of the order process; share your model and serial number when requesting parts. Supported wafer sizes and materials are matched to your process during OEM/ODM customization rather than fixed per catalog model.

Plasma Etching Equipment (RIE/ICP)

Plasma Etching Equipment

Fari Plasma builds plasma etching equipment for wafer-level etch, ashing, and resist-strip steps. Request equipment specifications for your process step.

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Featured Equipment

Our Plasma Etching Equipment Machines

Products

Etching

RIE ICP Etching Systems

Reactive ion etching (RIE) and inductively coupled plasma (ICP) reactors cover front-end film-etch and back-end structuring steps, with models such as the FR-G800 Dual-Chamber RIE Etcher.

Dual-Chamber RIE Etching

The FR-G800 Dual-Chamber RIE Etcher covers front-end film-etch steps with two chambers in one footprint.
Dual-Chamber ICP Etching

The FR-G800 ICP Dual-Chamber Etcher handles back-end structuring with a second chamber for higher wafer throughput.
Single-Chamber ICP

The ICP Inductively Coupled Plasma Etcher serves single-chamber ICP applications.
Single-Chamber RIE

The Single-Chamber RIE Etcher fits lower-volume or R&D runs where one chamber covers demand.

Post-Etch Steps

Plasma Ashing & Resist Stripping

Ashing and resist stripping run directly after etch, removing photoresist left on the wafer. The GD-20RF Plasma Asher handles oxygen-based removal, while the RIE Plasma Resist Stripping System combines strip and clean in one cycle.

Photoresist Removal

Oxygen-based ashing clears resist after etch.
Strip & Clean

One cycle combines resist stripping and cleaning.
Etch Line

Pairs with RIE/ICP etchers for a complete line.
Process Step

Runs directly after etch to remove leftover photoresist.

Specifications

Core Equipment Specifications

The lineup shares a PLC + touchscreen control architecture, verified on our RD-200 platform: 40 kHz RF reference frequency, plasma power adjustable across 1–5 kW, and 2 gas channels with mass flow control (MFC), down to roughly 75 mTorr (10 Pa) base pressure.

PLC + touchscreen control
2 gas channels with MFC

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deposition

PECVD & Related Deposition Systems

Fabs building a full front-end line beyond etch also need deposition tools.

The ICP CVD Dual-Chamber System and ICP CVD Plasma Deposition System use the same inductively coupled plasma source as our etch reactors, but for deposition rather than removal.

Plasma cleaners overcome this challenge by using high-speed, high-energy plasma to chemically and physically modify the surface. This process optimizes the material's surface, creating an active layer that is essential for successful subsequent operations like printing, bonding, and coating.

View Systems

Why Source Semiconductor Plasma Equipment From Fari

Fari has been a direct manufacturer since 2011, keeping engineering, assembly, and QC in-house. Each unit is checked before shipment, with plasma power output and gas flow calibrated and logged for traceability.

Direct Manufacturer

Engineering, assembly, and QC stay in-house rather than passing through a trading intermediary.
ISO 9001 & CE

ISO 9001 certified since 2021 and CE certification held across multiple plasma model lines.
Per-Unit QC

Each unit is checked for proper electrical operation and correct function before shipment.
Controlled Assembly

Assembly in controlled environments keeps chamber contamination out before the first process run.
Fast Turnaround

Rapid quoting and stocked inventory support faster turnaround on catalog configurations.

OEM/ODM

Custom Configuration & OEM/ODM

Chamber size, RF/ICP source configuration, gas channels, and automation interfaces are configurable per project, from conveyor integration to robotic wafer handling.

Chamber size and RF/ICP source configuration
Gas channels and automation interfaces
Conveyor integration, XYZ platforms, robotic wafer handling

Request Equipment Specifications or a Quote

Sourcing runs through four stages: technical evaluation, production, shipping in reinforced packaging, and after-sales support. Contact us with your target material and chamber size to begin.

Request a Quote

FAQ

What lead time for an RIE or ICP etch system?

Lead time depends on chamber configuration and any OEM/ODM customization. Production starts after the technical evaluation stage confirms your process spec, and a firm delivery date is issued with your quote.

What warranty and support come with the equipment?

Fari Plasma confirms warranty terms per order at quoting. Select configurations carry a 1-year warranty with lifetime technical support, and every unit ships with calibrated power, gas-flow, and plasma parameters.

Is factory acceptance testing available before shipment?

Every system runs a continuous operation test and is checked for electrical safety and correct function before it leaves the factory. On-site or remote FAT can be arranged case-by-case during the technical evaluation stage.

How many years is the warranty?

Warranty terms are confirmed per order at quoting. Select configurations carry a 1-year warranty with lifetime technical support, and every unit ships with serial-number traceability for service reference.

Are spare parts available?

Spare-parts support runs through the after-sales stage of the order process. Share your model and serial number when requesting parts so the right components are matched to your system.

Which materials and wafer sizes are supported?

Supported wafer sizes and materials are matched to your process during OEM/ODM customization rather than fixed per catalog model, so share your process spec during evaluation.

Cases